How to improve the packaging technology of SiC devices and modules, so as to give full play to the excellent performance of SiC? How to improve the reliability test system of vehicular power devices and modules? How to break the technical barriers of wafer and device manufacturing to improve yield and costs? The two major industries of automobile and semiconductor are facing many confusions and challenges regarding how to accelerate the application of third-generation power semiconductors in new energy vehicles.

The 3rd NEV & Power Semicon Collaborative Innovation Forum is be held in July 4-5, 2024, which is the only forum initiated by the automotive industry to focus on the power semicon of xEV drives.

The 3rd Forum will fully take the advantages of TMC resources in e-powertrains to gather related industrial institutions, OEMs, powertrain, e-motor control and power semiconductor companies, as well as universities and research institutions to discuss technical and supply chain strategies, innovative technologies and best engineering practices.