The 4th NEV & Power Semicon Collaborative Innovation Forum

20+

Speeches

Closed-door expert seminar

High-level panel discussion

30+

Exhibitors

50+

Experts

500+

Participants

The 3rd-generation semiconductor is increasingly used in NEVs, and the fourth-generation semiconductor is on the verge of taking off. However, there are still some issues, such as a high failure rate of new power modules, short R&D time, low overall production yield, lagging progress in trench-type MOS, dependence on imported high-end manufacturing equipment and core raw materials, and still a big room for improvement in packaging technology. Moreover, the demand for automotive power module packaging is diverse, and there is a need to strengthen industrial cooperation and resource integration.

The 4th Forum (incl. exhibition) will be held together with the TMC congress in June 12-13, 2025. The forum is expected to gather 400-500 representatives from governments, OEMs, powertrains, e-motor & control, power semiconductor companies, universities and research institutes to discuss innovative technologies and solutions for the aforementioned technical challenges and industry issues.

Topics

●Technology trends and industrial development of global 3rd and 4th generation vehicle power semiconductor

●Opportunities and challenges for the development of vehicle wide bandgap semiconductors in China

●Application trends of 4th-generation semiconductors in NEVs

●Innovative applications of SiC/GaN in eDrive system

●Applications of SiC/GaN in power supply unit (OBC, DCDC)

●Technological trends and reliability analysis of Si/SiC hybrid module

●Advanced SiC power module packaging technology

●Reliability testing and failure analysis of SiC power modules

●High production yield scheme for large-size substrates, epitaxy, and chips

●New structural design and manufacturing technology for power chips

●Advanced manufacturing equipment for yield improvement

●New packaging materials for power devices and modules and their applications

Exhibition Scope

●Power semiconductor devices and modules: SiC/IGBT/GaN modules, IGBT, GaN HEMT, SiC MOSFET, SBD, capacitor

●Substrate / epitaxial materials (SiC/GaN)

●Packaging, thermal dissipation, bonding, and sealing materials (packaging enclosures, packaging adhesives, epoxy resins, thermal conductive silicone grease, sintered silver, ceramic substrates, etc.)

●Power supply uint (OBC, DCDC)

●High voltage connectors, high voltage wire harness, relays, fuses, high voltage contactors, etc.

●Testing and production equipment including power cycling test system, crystal growth furnace and sintering/dispensing/cleaning/cutting machines, etc.

Previous participated companies

Semicon Related Companies (60+)

Anhui RedPower Microelectronics, BASiC Semiconductor, Best Compound Semiconductor, Boschman, BYD Semiconductor, Beijing Oriental Jicheng, Chroma ATE (Suzhou), Core energy semiconductor, CR MICRO PDBG, CUMEQ Electronics (Wuxi), Daixin (Shanghai) Electronics, EAGTOP, Epiworld, ESE-ETS, GCSEMI, Goermicro, GRANDA, GRG METROLOGY & TEST, HAIMOSIC, Hangzhou Garen, HEATSINK New Material, Hua Semiconductor, HUADA Semiconductor, Hunan Sanan, Infineon, ISE Labs China, Jiangsu Ferrotec Semiconductor, MOKE, NAVITAS, NOVOSENSE, NOVUSEM, Rogers, ROHM, Semikron-Danfoss, SICHAIN, Siener, Sumitomo Bakelite (Suzhou), Suzhou Convert, SwissSEM, Tongxin Microelectronics, TOPE, UAES, UniSiC, UNT, UNT Power, Wacker, Weldtone, Xindong-Semi, XiZ-Tech., Yangzhou Guoyang Electronics, Yangzhou Yangjie, YASC, Yuanshan (Jinan) Electronic, Zhuzhou CRRC Times Semiconductor...

OEMs

AION, Audi FAW NEV, BAIC, Beijing Benz, BMW, BYD, Changan, CHERY, DEEPAL, Dongfeng, FAW, GEELY, Great Wall, HMTC (Hyundai), JAC, LEAPMOTOR, Li Auto, NIO, Nissan, SAIC, SERES, TOYOTA, Xiaomi, Xpeng, Zeekr...

Powertrain (Including power modules production)

BorgWarner, BOSCH, Huawei, HYCET, INOVANCE, Magna, MITSUBISHI Electric, Shedrive, Schaeffler, Shanghai XPT, Vitesco, VREMT, Valeo, InfiMotion...

University & Research Institute

National New Energy Vehicle Center, Fudan University, Chinese Academy of Sciences (CAS), XiDian University, Huazhong University of Science and Technology, Hefei University of Technology, YOLE Intelligence...

THE 17TH INTERNATIONAL AUTOMOTIVE POWERTRAIN TECHNOLOGY CONGRESS