Beijing QLSEMl Technology Co., Ltd
QLsemi is headquartered in the Beijing Economic andTechnological Development Zone,with a equipment research&production base and a customer service center in Suzhou.The Company is committed to providing high-reliability packaging solutions for high-performance power devices.Our main business covers four main areas:R&D,production and sales of packaging materials and packaging & testing equipment,as well as packaging process development and device reliability evaluation.The company operates Class 1000 and Class 100 cleanrooms,ensuring stable mass production of products,which have been certified by IS09001,IS014001,IS045001,and IATF16949.
Product 1
Development technology/material/manufacturing process nameCopper Foil with Sintering Film
Innovation Highlights QLDTF7021 is a copper foil with sintering film suitable for chip top side sintering.It offers excellent electrical and thermal conductivity and high reliability. It can achieve highly reliable sintering connections on gold,silver,and copper substrates with a
sintering pressure as low as 15 MPa, providing a highly reliable solution for front-side packaging of high-power device chips.
Applications Traditional powertrains, hybrid Px, DHT, electric drive, etc.
重点词汇
21/5000
通用场景
Traditional power, hybrid power Px, DHT, electric drive, etc
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameAg Paste for Pressure Sintering
Innovation Highlights QLAg1109 is a nano-silver paste suitable for pressure sintering processes.It utilizes a self-developed paste formulation with excellent electrical and thermal conductivity and high shear strength.It can achieve reliable sintering connections on gold,silver, and copper substrates, providing a high-reliability packaging solution for high-power devices.
Applications Traditional powertrains, hybrid Px, DHT, electric drive, etc.
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameLarge Area Pressure Sintering Copper Paste
Innovation Highlights· No surface defects after printing and drying.
· Uniform thickness.
· Mild sintering conditions:220℃,10 MPa,10minutes.
· No defects detected by C-SAM aftersintering.
· High thermalconductivity,themal conductivity>160W/mK.
· High reliability.No delamination after 1000 cycles of thermal shocktest.
Applications Traditional powertrains, hybrid Px, DHT, electric drive, etc.
Photo of exhibits recommended