Hexcera Semiconductor Technology.,Ltd.

Hexcera Semiconductor Technology Co., Ltd.?(abbreviated as?Hexcera?), located at the JiWei Industrial Innovation Base, Haimen Economic Development Zone, Nantong City, Jiangsu Province, is a manufacturer specializing in?power semiconductor ceramic copper-clad substrates?(DCB/AMB). Established in March 2023, the company integrates R&D, manufacturing, sales, and services, focusing on the production of high-performance?Direct Bonded Copper (DCB)?and?Active Metal Brazed (AMB)?ceramic substrates. DCB/AMB Ceramic Copper-Clad Substrates Renowned for their exceptional?thermal conductivity,?electrical insulation,?heat resistance,?mechanical strength, and?chip-matching coefficient of thermal expansion (CTE), DCB/AMB substrates are recognized as the?most critical packaging materials?for modern power semiconductor devices. Core Competencies Hexcera? leverages its proprietary innovations in?brazing pastes,?reliability enhancement technologies, and?precision etching processes, supported by cutting-edge manufacturing equipment sourced from the United States, Japan, and domestic suppliers. This robust production system ensures full control over critical processes. Value Proposition With deep expertise in key manufacturing technologies, Hexcera? delivers?one-stop solutions?encompassing?material selection,?substrate fabrication,?packaging integration, and?performance testing. Our commitment to?quality excellence?and?customer trust?ensures substrates that meet stringent industrial standards while optimizing cost-efficiency for power electronics applications.