Pressure Silver Sintering DECA610-02T

DECA610-02T is a pressure silver sintering paste used for semiconductor chip bonding, specifically designed for power semiconductor packaging with ultra-high thermal conductivity requirements, such as SiC, GaN, IGBT, etc. Product Features 1、200 W/m·K high thermal conductivity 2、Strong die shear strength 3、Excellent stencil printing performanceSuitable for Ag or Au substrate 4、≤0.00001Ω·cm low volume resistivity 5、230℃ low temperature sintering 6、Lead free and halogen-free 7、Suitable for Ag or Au BSM chip

小量产

Power Module Chip

Pressure Silver Sintering DECA610-11W

DECA610-11W is a pressure silver sintering paste for large area sintering application (such as AMB, aluminum or copper heat sinks), specifically designed for applications with ultra-high thermal conductivity requirements, such as SiC, GaN, IGBT and other power semiconductor modules. Product Features ? 200 W/m·K high thermal conductivity ? ≤ 0.00001 Ω·cm low volume resistivity ? Strong die shear strength ? 230℃ low temperature sintering ? Excellent stencil printing performance ? Lead free and halogen-free ? Suitable for Ag or Au surface

小批量

Power module