United Nova Technology Co.,Ltd.

United Nova technology(688469.SH)was founded in 2018 and went public on the Shanghai Technology and Innovation Board Market in 2023. UNT is an innovative technology company in the semiconductor industry. With the vision of "Connecting Resources, Gathering Wisdom, Continuous Innovation, and Strongly Supporting the Global Smart Renewable Energy Revolution" ,UNT focuses on three main application markets: automotive, industrial control, and high-end consumer. UNT is dedicated to R&D, production, and sales of MEMS, IGBT, SiC MOSFET, analog ICs, and MCUs. It has established a comprehensive product layout, substantial technological accumulation, diverse process platforms and large-scale production capabilities. UNT is a scarce one-stop service foundry solution provider for chip systems in China. UNT boasts a complete range of technologically advanced automotive-grade high-quality power devices and power IC R&D and mass production platforms, making it an important domestic manufacturing base for automotive-grade and high-end industrial control chips and modules. Additionally, UNT focuses on continuously developing a unique and scarce BCD platform for analog ICs, with several new platforms already achieving large-scale production. After seven years of development, UNT has established three major business growth trajectories: IGBT, SiC MOSFET, and Analog ICs, under its "technology + market" dual-driven business strategy.

Product 1
Development technology/material/manufacturing process name

Miniaturized high power density IGBT power module

Innovation Highlights

The company has developed a compact automotive power semiconductor module specifically designed for range extenders and low-power inverter applications. It features a Pinfin structure for water cooling, which provides excellent thermal performance, allowing the chip's performance to be fully utilized. The power terminals can be connected by screws or laser welding, supporting applications of 750V and 1200V. They can be extended to IGBT and SiC modules, offering flexible configuration and wide application.

Development phase

台架测试

Applications

Electric Drive

Photo of exhibits recommended

Product 1
Development technology/material/manufacturing process name

High power density SiC MiniHPD module

Innovation Highlights

The company has developed a SiC Mini HPD module suitable for the power range of 100-400 kW. This module is equipped with mass-produced G1.7 SiC chips, with a chip voltage range covering 750-1500V, and can support voltage platforms over 1000V. It employs efficient thermal management and advanced packaging technology, offering exceptional current carrying capability and high reliability. The SiC module provides powerful performance for vehicles while minimizing operating energy consumption, enhancing system efficiency and range, resulting in quieter operation and an extraordinary driving experience.

Development phase

台架测试

Applications

Electric drive

Photo of exhibits recommended

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