Suzhou XiZ-Tech. Co., Ltd.
Suzhou XiZ-Tech. Co., Ltd. is committed to innovative high-frequency, packaging, and chip technologies, redefining the power electronics market and accelerating the globalization process of high-frequency power electronics and wide bandgap power semiconductors. It officially started operation on January 1, 2022.
Currently, there are approximately 60 R&D personnel, accounting for 30% of the total staff. With two office locations in Suzhou and Shanghai, it has received an investment of over 300 million yuan, obtained the TUV IATF 16949 system certification, and passed the audit as a potential supplier of Volkswagen (China).
Among them, a vehicle-grade packaging factory has been established in Suzhou, which has the capabilities of failure analysis, reliability assessment, and test development; a technology center has been established in Shanghai, which has the capability of test development.
Product 1
Development technology/material/manufacturing process nameSiC APM2 Power Module(Molded Half-Bridge Module），System Lstray<15nH，Tjmax=175℃，Id (Tcoolant = 65 °C)>650Arms
Innovation HighlightsUltra-Low loop inductance to lower voltage spike
Smaller parasitic resistance
Balanced Dynamic Current Sharing (BDCS)
Lower crosstalk voltage
Si3N4 substrate & pin-fin cooling structure for ultra-low thermal resistance
Maximum working junction temperature 175℃
Applications EV Traction Inverter
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameSiC APM4 Power Module(Molded 3-Phase Power Box），System Lstray<7nH，Tjmax=200℃，Id (Tcoolant = 65 °C)>600Arms
Innovation HighlightsUltra-Low loop inductance to lower voltage spike
Si3N4 substrate & pin-fin cooling structure for ultra-low thermal resistance
Maximum working junction temperature 200℃
Integrated waterway thermal design
More compact construction, higher power density
Six-in-one design, smaller size, more convenient assembly
Applications EV Traction Inverter
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameSiC HVDC3.0 high-voltage power supply module achieves a weighted efficiency of 95.1% and reduces the volume by 60%
Innovation HighlightsHigh-frequency technology implementation
Peak efficiency of 96.2%, weighted efficiency of 95%
Up to 12.5kW/L power density
Maximum continuous output current: 230A
Maximum continuous output power: 3kW
Advanced packaging technology
Ultra-low overall height
Ultra-low downward thermal resistance
Parallel operation for multi-kW arrays
Pre-charge, OV, OC, UV, short circuit and thermal shut down
ApplicationsAutomotive applications
Electric vehicles
High-density power supplies
Transportation
Photo of exhibits recommended