Anhui RedPower Microelectronics Co.,Ltd.
Anhui Redpower Microelectronics Co., Ltd. was established on June 28, 2019. As of now, the company's registered capital is 209.54 million yuan. It is located in Yijiang District, Wuhu City, Anhui Province. It is a strategic emerging enterprise specializing in the design of IGBT/FRD and silicon carbide MOS/SBD chips, power module packaging and testing, and system application solutions. The company focuses on the new energy market such as electric vehicles, wind power, photovoltaic, energy storage, and charging piles, while also taking into account the demands of power quality and industrial control. It is committed to growing into an outstanding domestic power semiconductor manufacturer.
Product 1
Development technology/material/manufacturing process nameAutomotive A5 Series IGBT Power Module
Innovation Highlights The A5 module features low loss and high power density, designed for 160℃ junction temperature operation, compatible with 400V/800V voltage platforms, and suitable for 50-180kW electric vehicle applications.
More compact than industry-standard package, (e.g., HPD)it adopts copper terminal laser welding technology and coreless current sensor compatibility. Equipped with Ruide 8th-generation chips, it sustains peak output of 540Arms. Combined with oval PinFin direct liquid cooling, it achieves higher power density. Its compact design and high compatibility meet demands for miniaturized electric equipment and integrated scenarios, propelling electric drive systems toward miniaturization and cost-effectiveness.
ApplicationsElectric drive
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Product 1
Development technology/material/manufacturing process nameAutomotive A6 Series IGBT Power Module
Innovation Highlights The A6 module features low loss, low stray inductance, and high thermal dissipation.,and is compatible with HPD.Designed for 400V/800V voltage platforms, it meets the power requirements of 50–220 kW for electric vehicle applications.
The module adopts an elliptical PinFin direct liquid cooling system to enhance heat dissipation capability. Equipped with RedPower's 8th-generation chips, it utilizes a multi-chip parallel connection design and laminated busbar pin layout to reduce voltage spikes during switching and minimize EMI, thereby improving system reliability. With a maximum continuous output of 650Arms, it fulfills the automotive industry's demand for high power density.
ApplicationsElectric drive
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Product 1
Development technology/material/manufacturing process nameAutomotive A4 Series IGBT Power Module
Innovation Highlights The A4 module features low loss, high reliability, and high power density, making it suitable for 400V voltage platforms with a maximum output power of up to 140kW.
Compatible with HP1 DC6(i) package series,this module employs press-fit packaging technology to eliminate welding stress and extend service life. Its PinFin direct liquid cooling structure reduces thermal resistance, lowering cooling costs. With its compact size, the module offers a more cost-effective solution compared to similar packaging technologies. The introduction of the A4 module will accelerate the evolution of electric vehicles toward higher power, enhanced reliability, and reduced costs.
ApplicationsElectric drive
Photo of exhibits recommended