DBA(Direct bonded aluminum)

DBA (Direct Bonded Aluminum) substrate features direct bonding of ceramic and aluminum without an interlayer, offering high thermal conductivity and strong dielectric strength. Compared to traditional substrates, it reduces thermal resistance and improves reliability, making it ideal for high-power applications like EVs, rail transit, and 10kV IGBT modules.

量产

Hybrid cars, industrial inverters, wind power electric vehicles, and orbital trains. goods, railway transportation, etc.

AMB (Active Metal Brazing)

AMB (Active Metal Brazing) is a further development of DCB technology. It is a method of bonding ceramic and metal by using a reaction layer generated by the reaction between a small amount of active elements contained in brazing filler metal and ceramic, which can be wetted by liquid brazing filler Metal.

量产

New energy vehicles, railway transportation, high power industry and other application fields.

DPC (Direct plating copper)

DPC (Direct plating copper) realizes the metallization of ceramic surface by magnetron sputtering and graphic plating technology, and then improves the oxidation resistance and solderability of substrate by finishing treatment, so as to realizes the precision line, and has better flatness and stronger bonding force.

量产

High power LED lighting, automotive headlights, semiconductor lasers, power electronic power devices, microwave, optical communication,RF devices, etc.