Jiangsu Ferrotec Semiconductor Technology Co.,Ltd
FLH provides its customers with coptive-covered ceramic carrier plates for power semiconductor modules, relying on the advanced production technology acquired by Ferrotec Group in the field of coptive-covered ceramic carrier plates for 30 years since 1995. Adhering to the business philosophy of "diligence, determination, development, and excellence", we provide strong support for the rapid development of semiconductor power module business by providing service and support to our customers with higher and more refined quality.Ferrotec(FLH) headquarters (Jiangsu Ferrotec Semiconductor technology Co., LTD.) is located in High-tech zone, Dongtai, Jiangsu province of China, which is specialized in the business of copper bonded ceramic substrate (AMB, DCB and DPC) for power semiconductor, integrating R&D, manufacturing, sales, providing power semiconductor manufacturers a complete set of solution from materials, manufacture, assembly and test.
Its subsidiaries include Shanghai Ferrotec Power Semiconductor Co., LTD., Jiangsu Ferrotec Power Semiconductor R&D Institute Co., LTD., Shanghai Ferrotec International Trading Co., LTD., Sichuan Ferrotec Power Semiconductor Technology Co., Ltd., Ferrotec Power Semiconductor Malaysia SDN.BHD., Ferrotec Power Semiconductor (Singapore) PTE. LTD., and subsidiaries in Europe, Japan.
Product 1
Development technology/material/manufacturing process nameDBA(Direct bonded aluminum)
Innovation HighlightsDBA (Direct Bonded Aluminum) substrate features direct bonding of ceramic and aluminum without an interlayer, offering high thermal conductivity and strong dielectric strength. Compared to traditional substrates, it reduces thermal resistance and improves reliability, making it ideal for high-power applications like EVs, rail transit, and 10kV IGBT modules.
ApplicationsHybrid cars, industrial inverters, wind power electric vehicles, and orbital trains.
goods, railway transportation, etc.
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameAMB (Active Metal Brazing)
Innovation HighlightsAMB (Active Metal Brazing) is a further development of DCB technology. It is a method of bonding ceramic
and metal by using a reaction layer generated by the reaction between a small amount of active elements
contained in brazing filler metal and ceramic, which can be wetted by liquid brazing filler Metal.
Applications New energy vehicles, railway transportation, high power industry and other application fields.
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process name DPC (Direct plating copper)
Innovation Highlights DPC (Direct plating copper) realizes the metallization of ceramic surface by magnetron sputtering and graphic plating technology, and then improves the oxidation resistance and solderability of
substrate by finishing treatment, so as to realizes the precision line, and has better flatness and stronger bonding force.
Applications High power LED lighting, automotive headlights, semiconductor lasers, power electronic power devices,
microwave, optical communication,RF devices, etc.
Photo of exhibits recommended